? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 1 pacdn2404c/2408c/2416c esd protection arrays, chip scale package features ? 4, 8, or 16 transient voltage suppressors in a single package in-system electrostatic discharge (esd) protection to + 18kv contact discharge per iec 61000-4-2 international standard supports ac signal applications compact chip scale package (0.65mm pitch) for- mat saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages lead-free versions available applications esd protection for sensitive electronic equipment i/o port, keypad and button circuitry protection for portable devices wireless handsets handheld pcs / pdas mp3 players digital cameras and camcorders notebooks desktop pcs product description the pacdn2404c, pacdn2408c and pacdn2416c are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to esd. the back- to-back zener connections provide esd protection in cases where nodes with ac signals are present. these devices are designed and characterized to safely dissipate esd strikes at levels well beyond the maximum requirements set forth in the iec 61000-4-2 international standard (level 4, + 8kv contact dis- charge). all i/os are rated at + 18kv using the iec 61000-4-2 contact discharge method. using the mil- std-883d (method 3015) specification for human body model (hbm) esd, all pins are protected for con- tact discharges to greater than + 30kv. the chip scale package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, pdas, internet appliances and pcs. the large solder bumps allow for standard attachment to laminate boards with- out the use of underfill. the pacdn2404c, pacdn2408c and pacdn2416c are available with optional lead-free finishing. a1 a2 a3 b1 b2 b3 c2 c3 c4 d2 d3 d4 c5 d5 c1 d1 a2 a3 a4 b2 b3 b4 a5 b5 a1 b1 a2 a4 b2 b4 a5 b5 a1 b1 a3 electrical schematic pacdn2404c pacdn2408c pacdn2416c
? 2003 california micro devices corp. all rights reserved. 2 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 10/10/03 pacdn2404c/2408c/2416c ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices are specified by using a " + " character for the top side orientation mark dn 2416 3 25 4 1 b a d c orientation marking (see note 2) dn2408 3 25 4 1 b a orientation marking (see note 2) d24 3 2 1 b a orientation marking (see note 2) c3 d3 c2 c1 d2 d1 c5 d5 c4 d4 a3 b3 a2 a1 b2 b1 a5 b5 a4 b4 a3 b3 a2 a1 b2 b1 a5 b5 a4 b4 a3 b3 a2 a1 b2 b1 pacdn2404c csp package package / pinout diagrams notes: bottom view (bumps up view) top view (bumps down view) pacdn2408c csp package bottom view (bumps up view) top view (bumps down view) csp package pacdn2416c bottom view (bumps up view) top view (bumps down view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 6 csp pacdn2404c d24 PACDN2404CG d24 10 csp pacdn2408c dn2408 pacdn2408cg dn2408 20 csp pacdn2416c dn2416 pacdn2416cg dn2416
? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 3 pacdn2404c/2408c/2416c specifications note 1: t a =25 c unless otherwise specified. gnd in this document refers to the lower supply voltage. note 2: esd applied to channel pins with respect to gnd, one at a time. all other channels are open. all gnd pins tied to ground . note 3: these parameters are guaranteed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics 1 symbol parameter conditions min typ max units v rev reverse standoff voltage i diode =10 a5.9 v i leak leakage current v in =3.3v dc 100 na v sig signal clamp voltage positive clamp negative clamp i load = 10ma 6.0 -9.2 7.6 -7.6 9.2 -6.0 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2 & 3 + 30 + 18 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2 & 3 +14 -14 v v c channel capacitance at 2.5v dc, f = 1mhz 39 47 pf
? 2003 california micro devices corp. all rights reserved. 4 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 10/10/03 pacdn2404c/2408c/2416c application information refer to application note ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 1. recommended non-solder mask defined pad illustration figure 2. eutectic (snpb) solder ball reflow profile figure 3. lead-free (snagcu) solder ball reflow profile printed circuit board recommendations parameter value pad size on pcb 0.300mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.350mm round solder stencil thickness 0.125 - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.360mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds soldering maximum temperature 260 c solder mask opening 0.350mm dia. non-solder mask defined pad 0.300mm dia. solder stencil opening 0.360mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 5 pacdn2404c/2408c/2416c mechanical details the pacdn2404c/2408c/2416c devices are pack- aged in custom chip scale packages (csp). pacdn2404c 6-bump csp mechanical specifications the pacdn2404c devices are packaged in a 6-bump custom chip scale package (csp). dimensions are presented below. package dimensions for pacdn2404c 6-bump chip scale package csp tape and reel specifications figure 4. tape and reel mechanical data package dimensions package custom csp bumps 6 dim millimeters inches min nom max min nom max a1 1.109 1.154 1.199 0.0437 0.0454 0.0472 a2 1.759 1.804 1.849 0.0693 0.0710 0.0728 b1 0.645 0.650 0.655 0.0254 0.0256 0.0258 b2 0.645 0.650 0.655 0.0254 0.0256 0.0258 b3 0.645 0.650 0.655 0.0254 0.0256 0.0258 c1 0.202 0.252 0.302 0.0080 0.0099 0.0119 c2 0.202 0.252 0.302 0.0080 0.0099 0.0119 d1 0.600 0.644 0.687 0.0236 0.0253 0.0271 d2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 1 2 3 b c1 b1 a1 b2 c2 dimensions in millimeters d1 d2 a2 bottom view side view a b3 0.35 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel dia. qty per reel p 0 p 1 pacdn2404c 1.804 x 1.154 x 0.644 1.98 x 1.32 x 0.91 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
? 2003 california micro devices corp. all rights reserved. 6 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 10/10/03 pacdn2404c/2408c/2416c mechanical details (cont?d) pacdn2408c 10-bump csp mechanical specifications the pacdn2408c devices are packaged in a 6-bump custom chip scale package (csp). dimensions are presented below. package dimensions for pacdn2408c 10-bump chip scale package csp tape and reel specifications figure 5. tape and reel mechanical data package dimensions package custom csp bumps 10 dim millimeters inches min nom max min nom max a1 1.109 1.154 1.199 0.0437 0.0454 0.0472 a2 3.059 3.104 3.149 0.1204 0.1222 0.1240 b1 0.645 0.650 0.655 0.0254 0.0256 0.0258 b2 0.645 0.650 0.655 0.0254 0.0256 0.0258 c1 0.202 0.252 0.302 0.0080 0.0099 0.0119 c2 0.202 0.252 0.302 0.0080 0.0099 0.0119 d1 0.600 0.644 0.687 0.0236 0.0253 0.0271 d2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 dimensions in millimeters a b 0.35 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 pacdn2408c 3.104 x 1.154 x 0.644 3.28 x 1.32 x 0.81 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 7 pacdn2404c/2408c/2416c mechanical details (cont?d) pacdn2416c 20-bump csp mechanical specifications the pacdn2416c devices are packaged in a 20-bump custom chip scale package (csp). dimensions are presented below. package dimensions for pacdn2416c 20-bump chip scale package csp tape and reel specifications figure 6. tape and reel mechanical data package dimensions package custom csp bumps 20 dim millimeters inches min nom max min nom max a1 2.409 2.454 2.499 0.0948 0.0966 0.0984 a2 3.059 3.104 3.149 0.1204 0.1222 0.1240 b1 0.645 0.650 0.655 0.0254 0.0256 0.0258 b2 0.645 0.650 0.655 0.0254 0.0256 0.0258 c1 0.202 0.252 0.302 0.0080 0.0099 0.0119 c2 0.202 0.252 0.302 0.0080 0.0099 0.0119 d1 0.600 0.644 0.687 0.0236 0.0253 0.0271 d2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 dimensions in millimeters a b c d 0.35 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 pacdn2416c 3.104 x 2.454 x 0.644 3.28 x 2.64 x 0.86 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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